7

Interface behavior study of WC92–Co8 coating produced by electrospark deposition

Year:
2005
Language:
english
File:
PDF, 441 KB
english, 2005
8

MGRS: A multi-granulation rough set

Year:
2010
Language:
english
File:
PDF, 465 KB
english, 2010
9

The formation of a single-pulse electrospark deposition spot

Year:
2005
Language:
english
File:
PDF, 655 KB
english, 2005
16

Sn concentration on the reactive wetting of high-Pb solder on Cu substrate

Year:
2006
Language:
english
File:
PDF, 167 KB
english, 2006
18

Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance

Year:
2006
Language:
english
File:
PDF, 195 KB
english, 2006
20

Micromechanical properties of heterogeneous aluminum–silicon brazed joint

Year:
2004
Language:
english
File:
PDF, 586 KB
english, 2004
21

Strengthening Sn60–Pb40 solder alloy by adding trace amount of La

Year:
2002
Language:
english
File:
PDF, 205 KB
english, 2002
23

Residual clad formation and aluminum brazed joint topology prediction

Year:
2003
Language:
english
File:
PDF, 511 KB
english, 2003
24

Effect of La on the Sn-rich halo formation in Sn60–Pb40 alloy

Year:
2001
Language:
english
File:
PDF, 325 KB
english, 2001
37

A Study of Sn-Pb-Re Solder

Year:
1993
Language:
english
File:
PDF, 2.44 MB
english, 1993
38

Numerical Analysis of the Ball Forming Process in Copper Ball Bonding

Year:
1991
Language:
english
File:
PDF, 2.04 MB
english, 1991
40

A Study of the Copper Wire Ball Bonding Processes

Year:
1992
Language:
english
File:
PDF, 1003 KB
english, 1992